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Using a Heat Transfer Analogy to Solve for Squeeze Film Damping and Stiffness Coefficients in MEMS Structures
  Dale Ostergaard, Jan Mehner
  This paper provides background information on using a heat transfer analogy to solve the Reynolds equation (squeeze film damping). Although ANSYS now has FLUID136 and FLUID138 to solve such problems, this paper can be useful in gaining a better understanding of these types of analyses.
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