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Numerical Evaluation of Thermal Cycling Reliability of High Performance Flip-Chip Package Assembly Using Submodeling Analysis
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Chin-Li Kao, Yi-Shao Lai, and Tong Hong Wang
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"This paper applies the submodeling technique in analyzing thermal cycling reliability
of high performance flip-chip ball grid array package assemblies. The packages
have one-piece tunnel-type heat spreaders with different lead widths, connected
to chips using different thermal interface materials. The global model contains no
solder bumps to simplify the analysis. The calculated displacement field of the global
model is then interpolated on the boundary of the submodel that contains the critical
solder bump. The submodel is solved using the prescribed displacement boundary
conditions together with external thermal loads to evaluate thermomechanical reliability
of the critical solder bump."
ANSYS Nonlinear (Anand Model), version 7.0
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Average Rating: 10.0 (2 votes)
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