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Numerical Analysis of Plastic Encapsulated Electronic Package Reliability: Viscoelastic Properties of Underfill Resin
  Man-Lung Sham, Jang-Kyo Kim, Joo-Hyuk Park
  "The reliability and mechanical performance of electronic integrated circuit (IC) package is studied based on the finite element analysis."
ANSYS Nonlinear, version 5.7.
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