ansys.net search results quick file search:     home » search results   collections   input file library   macro library   tips & tricks   tech papers   undocumented   resources   ansys news   useful links   animation gallery   engineering   tools & utilities   material links   web resources   book references   general info   about this site   website updates   fea-nux blog   twitter   rss feed       Specific Search Results Below:   A Compilation of Anand Parameters for Selected SnPb and Pb-free Solder Alloys   Zane Johnson (University of Minnesota)   "Finite-element (FE) simulation is widely used in electronic packaging. It is particularly useful in the design of solder joint attachments. To ensure fidelity, FE simulation must capture the highly nonlinear behavior of solder. One useful material model for solder is Anand’s viscoplastic model. A compilation of Anand parameters reported in the literature for a variety of solder alloys is provided." [permalink]   Average Rating: 10.0 (3 votes)   Rate this item: 10 (Good)50-5-10 (Bad)     all pages manually coded in PHP/MySQL & HTML/CSS with a text editor utilizes (possibly valid) HTML 4.01, CSS 2.0, RSS 2.0, and OpenSearch 1.1 please note that this site makes use of cookies site created & maintained by sheldon imaoka ANSYS, ANSYS Workbench, Ansoft, AUTODYN, CFX, EKM, Engineering Knowledge Manager, FLUENT, HFSS and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are trademarks or registered trademarks of ANSYS, Inc. or its subsidiaries located in the United States or other countries. ICEM CFD is a trademark used by ANSYS, Inc. under license. CFX is a trademark of Sony Corporation in Japan. All other brand, product, service and feature names or trademarks are the property of their respective owners.