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A Compilation of Anand Parameters for Selected SnPb and Pb-free Solder Alloys
  Zane Johnson (University of Minnesota)
  "Finite-element (FE) simulation is widely used in electronic packaging. It is particularly useful in the design of solder joint attachments. To ensure fidelity, FE simulation must capture the highly nonlinear behavior of solder. One useful material model for solder is Anandís viscoplastic model. A compilation of Anand parameters reported in the literature for a variety of solder alloys is provided."
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